PowerSnap Series

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Supporting High Power

Winchester’s PowerSnap is an ideal solution for transferring high power from a printed circuit board to anywhere inside a device.

Reliable Performance in Harsh Environments

PowerSnap’s unique features provide a robust alternative to weak soldered wires, a more reliable alternative to cable lugs, and a better-suited solution than modified RF connectors for harsh environments.

Standard and Custom Configurations

If you have a specific part number you’re interested in, use our distributor inventory search to see what is available today, or contact us for custom designs.

Key Features

Snap feature for improved mating
Non-magnetic
Low mated-pair profile – enables power in tight spaces
Custom designs based on your system requirements
SMT, Cable, and Thru-Hole designs
Due to its small size, the PowerSnap allows for multiple connections in densely configured arrangements
Capable of carrying current up to 40 Amps, depending on configuration

Technical Specifications

Temperature Range: 200° F
Materials: Brass, Gold Plating
Mil Std: MIL-STD-202G
Durability: 200 Cycles, Min

PowerSnap Series

Supporting High Power

Reliable Performance in Harsh Environments

Standard and Custom Configurations

Key Features

Technical Specifications

RF Assemblies

BMA Series

RF Coax Cable