PowerSnap Series

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Supporting High Power

Winchester’s PowerSnap is an ideal solution for transferring high power from a printed circuit board to anywhere inside a device. 

Reliable Performance in Harsh Environments

PowerSnap’s unique features provide a robust alternative to weak soldered wires, a more reliable alternative to cable lugs, and a better-suited solution than modified RF connectors for harsh environments.

Standard and Custom Configurations

If you have a specific part number you’re interested in, use our distributor inventory search to see what is available today, or contact us for custom designs.

PowerSnap Feature

Key Features

  • Snap feature for improved mating
  • Non-magnetic
  • Low mated-pair profile – enables power in tight spaces
  • Custom designs based on your system requirements
  • SMT, Cable, and Thru-Hole designs
  • Due to its small size, the PowerSnap allows for multiple connections in densely configured arrangements
  • Capable of carrying current up to 40 Amps, depending on configuration

Technical Specifications

  • Temperature Range: 200° F
  • Materials: Brass, Gold Plating 
  • Mil Std:  MIL-STD-202G
  • Durability: 200 Cycles, Min