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PowerSnap Series

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Supporting High Power

Winchester’s PowerSnap is an ideal solution for transferring high power from a printed circuit board to anywhere inside a device. 

Reliable Performance in Harsh Environments

PowerSnap’s unique features provide a robust alternative to weak soldered wires, a more reliable alternative to cable lugs, and a better-suited solution than modified RF connectors for harsh environments.

Standard and Custom Configurations

If you have a specific part number you’re interested in, use our distributor inventory search to see what is available today, or contact us for custom designs.

PowerSnap power connectors by Winchester Interconnect
PowerSnap power connectors by Winchester Interconnect

Key Features

  • Snap feature for improved mating
  • Non-magnetic
  • Low mated-pair profile – enables power in tight spaces
  • Custom designs based on your system requirements
  • SMT, Cable, and Thru-Hole designs
  • Due to its small size, the PowerSnap allows for multiple connections in densely configured arrangements
  • Capable of carrying current up to 40 Amps, depending on configuration

Technical Specifications

  • Temperature Range: 200° F
  • Materials: Brass, Gold Plating 
  • Mil Std:  MIL-STD-202G
  • Durability: 200 Cycles, Min
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