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When there is no room for a larger connector such as a Micro-D, the nano form factor provides a solution. Our nano conforms to the ‘mil spec’ for this relatively new form factor.
All Winchester Interconnect hermetic multi-pin connectors utilize exclusive Ceramax® dielectric compound in conjunction with BeCu contacts to create a best-in-class hermetic seal. Ceramax® is impervious to crack propagation, which is the #1 failure mode of conventional glass seals and lesser ceramics.
Utilizing Winchester’s exclusive ceramic dielectric material in our connector manufacturing processes, as well as joining dissimilar metals through explosion welding, vacuum brazing, laser welding, and diffusion bonding, we are able to produce superior, high performance hermetically sealed interconnect solutions that can adapt to any material.
